- VRM and aluminum I/O heatsink
A VRM heatsink on the MOSFETs and chokes is connected to the aluminum I/O cover via an integrated heat pipe to increase mass and surface area for dissipation.
- M.2 heatsink and backplates
Large aluminum heatsinks provide extensive surface area for cooling mounted M.2 units, while each of the card's three slots features a dedicated plate for additional heat dissipation.
- High-conductivity thermal pads
Each thermal pad improves overall heat transfer from the system by bridging the heat generated by the power stages to the heatsink. For future maintenance, a replacement thermal pad is also included in the package.
An electro-galvanized steel plate reinforces the spine of the ROG Maximus Z790 Hero to prevent bending.
A dedicated heatsink removes heat from the chipset to maintain optimal operating temperature.