CPU overclocking requires higher current. ASRock's Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power plugs, providing a more stable system and reducing the risk of fire during intense overclocking.

ASRock, which originates from the design concept "built for stable and reliable", makes no compromises on any detail. This motherboard is made with high-quality materials, and enthusiastic users can enjoy boosting DDR5 memory overclocking performance by enabling pre-tested profiles. Ensure that the memory modules are capable of Intel® XMP/AMD EXPO™ and overclocking can be made so accessible, satisfying, and sweat-free.

The first thing that catches the eye is the optimized design of the aluminum heatsink. Heatsinks are vital for effective heat dissipation, especially during heavy workloads such as gaming or productivity tasks. Motherboards built with heatsinks can effectively manage thermal performance and, therefore, effortlessly ensure the system's stability and durability.

The smart LAN 2.5Gb/s platform is built for maximum networking performance for the demanding requirements of home networking, content creators, online gamers, and high-quality streaming media. Enhancing networking performance up to 2.5 times the bandwidth compared to standard Gigabit Ethernet, you will enjoy the fastest and uncompromised connectivity experience for gaming, file transfers, and backups.

The reinforced steel slot can support the PCI Express 5.0 standard. The various benefits include:

• Additional anchor points 
• Stronger latch 
• Ensure signal stability 
• Ensure that heavy graphics cards are well installed.