Intel® Core™ Ultra processors (series 2) are packed with advanced "Foveros Advanced 3D packaging technology" that includes 4x different tiles (Tiles or Chiplets), the SOC tile, GPU tile, Compute tile, and I/O tile. The "Compute" tile (3nm TSMC) integrates the processor's physical P and E cores. The SOC tile (6nm TSMC) integrates a 3rd generation neural processing unit (NPU 3) featuring 2x compute engines, the DDR5 memory controller, and the PCI-Express root complex along with the Display Engine, Media Acceleration Engine, and Display I/O for graphics. The GPU tile carries the integrated Intel® Arc™ graphics (disabled in KF and F-Series models) and the I/O tile contains various interfaces (e.g., a second PCIe® Gen 4 controller, a Thunderbolt™ 4 controller, etc.).
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