CPU overclocking requires higher current. ASRock's Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power plugs, providing a more stable system and reducing the risk of fire during intense overclocking.

ASRock, which stems from the design concept "built for stable and reliable," does not compromise on any detail. This motherboard is made with high-quality materials, and enthusiastic users can enjoy enhancing the performance of DDR5 memory overclocking by enabling the pre-tested profiles. Ensure that the memory modules are capable of Intel® XMP/AMD EXPO™ and overclocking can become so accessible, satisfying, and effortless.

The first thing that catches the eye is the optimized design of the aluminum heatsink. Heatsinks are crucial for effective heat dissipation, especially during heavy workloads such as gaming or productivity tasks. Motherboards built with heatsinks can effectively manage thermal performance, thereby effortlessly ensuring system stability and durability.

Εκτός από τον ενσωματωμένο φωτισμό RGB, διαθέτει επίσης ενσωματωμένες κεφαλές RGB και μια διευθυνσιοδοτούμενη κεφαλίδα RGB που επιτρέπουν τη σύνδεση της μητρικής κάρτας με συμβατές συσκευές LED, όπως ταινίες, ανεμιστήρες CPU, ψύκτρες, κουτί και ούτω καθεξής. Οι χρήστες μπορούν επίσης να συγχρονίσουν τις συσκευές LED RGB στα πιστοποιημένα αξεσουάρ Polychrome RGB Sync για να δημιουργήσουν τα δικά τους μοναδικά εφέ φωτισμού.

The latest USB 3.2 Gen2x2 Type-C port provides data transfer speeds of up to 20 Gbps, which is 2 times faster than the previous generation, offering an incredibly fast data transfer interface with a reversible USB Type-C design that fits the plug in any direction.