High performance - Very soft, silicone-based with a special filler material, the TP-3 outperforms high-performance pads, especially when the height differences of closely placed chips usually appear due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite its extremely low hardness.

Minimizing thermal resistance - The thinner the pad, the less the thermal resistance. The 0.5 mm thick TP-3 pad can easily be compressed to 0.3 mm and thus compensate for height differences among various components up to 0.2 mm. Please note that due to the extremely low hardness, placing the 0.5 mm pad requires particular care.

Flexible applications - Thermally conductive, shock-absorbing, formable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft thermal conductive pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard form for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut into the desired shape and size.

Safe handling - The ARCTIC TP-3 is electrically insulating, non-adhesive, and easy to handle. This means that optimal and safe heat transfer can be ensured in many areas of application.

Bridging gaps - The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights. Thanks to their good compressibility properties, thermal pads act as the perfect gap filling material and bridge uneven surface and air gaps without stressing sensitive and protruding components.

Available in different thicknesses and sizes - Thermal pads are available in 0.5 mm, 1.0 mm, and 1.5 mm options. The 0.5 mm variant is ideal as an alternative to thermally conductive aluminum foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.