AG Thermally Conductive Glue TermoGlue - a great way to secure heat sinks, e.g., memory chips, transistors, or bridges. The connection created is extremely strong and has excellent heat transfer characteristics.

• Color: white
• Surface drying time: [25 °C, minutes] 2-8
• Hardness: 45-75
• Tensile strength: 2.0 Mpa
• Elongation: 100%
• Thermal conductivity: > 1.0 W / mK
• Volume resistance: < 2.0 x 10 ^ 15 c-in / W
• Dielectric strength: 20 KV / mm
• Dielectric loss factor (60Hz): 0.003
• Operating temperature: 200 °C